Open Positions

Position: Ph.D. Student, Postdoctoral Researcher

Research focuses on the design and implementation of high-performance, low-cost and application specific RF/microwave/mm-wave integrated circuits using state-of-the-art SiGe BiCMOS (fT/fMAX of 300/500 GHz) technologies. In particular, the research team is interested in design of wireless transceivers and subsystems which includes related front-end integrated circuits like power amplifiers, low noise amplifiers, voltage controlled oscillators, phase shifters, mixers and phase-locked-loop as well as passive components; inductors and RF switches. Application areas include X-band phased array radar T/R modules, 5G communication circuits, passive radiometric imaging systems, etc.

• The candidate must have a diploma, B.Sc., M.Sc., or equivalent in electrical/electronics engineering.
• Solid background on BiCMOS analog/RF integrated circuits is essential.
• In-depth understanding of IC design flow using Cadence or other CAD tools.
• Tape-out experience is not required but a plus.
• Experience with EM simulation tools like Sonnet and ADS is a plus.

Position: Ph.D. Student, Postdoctoral Researcher

Research focuses mostly on readout technologies for infrared detectors. Infrared imaging systems are used in surveillance, medical imaging, astronomy, industry and weather forecasting. Readouts are bonded directly to the detector using flip chip bonding method. Readouts are responsible for pre-amplification, integration and processing of photo currents from the detectors. Readout electronics consist of analog and digital sub-blocks such as preamplifier, opamp, buffer, counter, comparator, ADC and DAC. Design targets are low power operation, low noise, linearity, process invariance, etc. ROICs operating both at room and cryogenic temperatures, and operating in different infrared bands (NIR, SWIR, MWIR, LWIR and VLWIR) are research interests.

• The candidate must have a diploma, B.Sc., M.Sc., or equivalent in electrical/electronics engineering.
• Solid background on CMOS analog integrated circuits is essential.
• In-depth understanding of IC design flow using Cadence or other CAD tools.
• Tape-out experience is not required but a plus.
• Experience with Veriloh/HDL is a plus.

Position: Ph.D. Student, Postdoctoral Researcher

Research focuses on MEMS-based devices for wireless and life science applications. The group works in a multidisciplinary environment spanning materials, designing and simulating microsystems, fabrication process development and characterization. The main focus of the future research will be on modeling, design, fabrication and characterization of (1) lab-on-a-chip device (biosensors and microfluidics) for the detection of disease markers, (2) low power RF devices for wireless communications, (3) novel device structures for application in the field of infrared detection and inertial sensors (gyro sensors and accelerometers). We offer a challenging, multinational environment, with excellent career prospects for highly motivated individuals. The successful candidates will have access to the fabrication and characterization facilities at Sabanci University Nanotechnology Application Centre (SUNUM).

• The candidate must have a diploma, M.Sc., B.Sc., or equivalent in electrical/electronics engineering.
• Knowledge of semiconductor and MEMS fabrication process is a must.
• Experience in RF/microwave design and device characterization.
• Hands-on experience of CAD tools: ANSYS, Coventorware, COMSOL and MEMSCAP.

Position: Ph.D. Student, Postdoctoral Researcher

Research is in the area of micro/nano/MEMS-based devices for energy harvesting and IR detection applications. The group is working in a multidisciplinary environment spanning material, optoelectronics, and microelectronics aspects: design, simulation, fabrication, process development and characterization. The main focus of the research is on modeling, design, fabrication and characterization of highly efficient rectifying antenna (rectenna) power collector, consist of nano-antenna and MIM diode, for IR-Near Space Plane applications. The candidate is expected to do (1) research on MIM/MIIM diodes and nano-antenna structures, (2) modeling, simulation and fabrication of rectenna devices, and (3) coordination of research tasks and technical collaboration with project partners.

• PhD degree (for postdoctoral researchers) or MSc degree (for PhD applicants) in physics, material engineering or electrical/electronics engineering.
• Solid knowledge of solid-state devices/physics and micro/nanofabrication processes.
• Knowledge on related CAD tools (TCAD device design and simulation, HFSS (Ansys), COMSOL) is desirable.

Below you can see a list of graduation projects offered in recent years.

RF/microwave Front-End Integrated Circuits for 94/140/240 GHz Passive Imaging and Spectroscopy Applications

In this project, students will work on the design and realization of RF/microwave integrated circuits (LNA, SPDT and MEMS switch, power detector, on-chip antenna etc.) for 94/140 GHz single-chip passive imaging and 240 GHz Spectroscopy applications using high-performance (fT/fMAX of 300/500 GHz) heterojunction bipolar transistors (HBT) and RF-MEMS devices. This project will be carried out in collaboration with IHP-Microelectronics (Germany).

Development of SiGe Bolometers (IR Detector) and Readout Integrated Circuits for IR Imaging Applications

In this project, students will be expected to design sige-based micbolometer / IR detector and CMOS readout integrated circuits (ROICs). Students in this project will be using CAD tolls such as Cadence, Synopsys, Cadence Encounter, ANSYS and Silvaco for their designs and simulations of detectors and roics and will be using and developing further background on semiconductor physics, optoelectronics, analog and mixed-signal integrated circuits, detectors/bolometers/IR sensors, and microfabrication. The project will be carried out in collaboration with IHP-Microelectronics (Germany), providing technology for the realization of both roics and SiGe Microbolometers.

RF Integrated Circuits for X-Band (8-12 GHz) Phased Array RADAR Applications

In this project, students will first study system level architecture of phased-array radar systems and investigate different sub-blocks of X-Band transceiver modules, such as low-noise amplifier, power amplifier, T/R switch, SPDT switch, phased shifter etc. Afterwards, students will be assigned one of these sub-blocks, based on their interests and the requirements of the project. Students are expected to perform a strong literature research and come up with their own designs. Students will be using CAD tools such as Cadence, Sonnet, ADS for design, simulation and verification purposes. Finally students are expected to realize their designs in IHP 0.25-um SiGe BiCMOS process. There will be weekly meetings for monitoring the progress of the project. While working on this project, students will gain experience on RF/analog device and circuit technologies; analog and RF circuit design methodologies; transceiver systems, specifications and applications; analog/RF test and measurements; conference/journal papers and experience in engineering and scientific working environments. Minimum required courses: Analog IC and Introduction to RF.

Human Brain Project (HBP)

The Human Brain Project (HBP) is part of the FET Flagship Programme, which is a new initiative launched by the European Commission as part of its Future and Emerging Technologies (FET) initiative. Over the course of the 10-year project, HBP researchers' (Hundreds of scientists, 112 institutions, 24 countries, 12 research areas) goal is to generate a global collaborative effort to integrate neuroscience data from around the world, to understand the human brain and its diseases, and ultimately to emulate its computational capabilities. As one of the HBP research team and the only research team/partner from Turkey, our effort has been focused on developing hardware devices incorporating state-of-the-art electronic component and circuit technologies as well as new knowledge arising from other areas of HBP research (experimental neuroscience, theory, brain modelling). Students involved in this project will work on developing low-noise, low power building blocks of the HBP hardware platforms, using mixed-signal integrated circuits at 60, 45, 22 nm CMOS technologies.

Lab-on-a-Chip Platform for the Detection and Quantification of Cancer and Cardiovascular Disease Markers

The goal of this research is to develop a label-free, micro-smart, miniaturised and integrated Lab-on-a-Chip (LoC) system for on-site/remote detection and quantification of multiplexed biomarkers for cancer and cardiovascular disease applications. The four key components of this chip are: (a) an affinity based capacitive biosensing chip, (b) microfluidics/cartridge (c) signal processing hardware platform integrated with wireless communication system, and (d) data analysis software that calculates the concentration of the biomarker according to given standard curve and presents the result to the user. Students involved in this project can take part in the development of one or more components of this chip (biosensors, microfluidics, signal processing harware platform, and software development). This project has been carried out in collaboration with Anadolu Saglik Merkezi (ASM) and sponsored by TUBITAK's one of the large-scaled funding schemes (1003).

Development of a THz Rectenna for Heat Harvesting and IR Imaging Applications

A rectenna is an electronic device that composed of a diode in conjunction with an antenna. In this project, we are aiming at developing a high efficiency rectenna, operating in THz region and to be capable of converting waste heat (THz radiation) from an environment to into DC power. The structure of the project involves (1) designing/modelling of rectennas, (2) fabrication of the successfully modeled rectennas, involving micro/nanofabrication, (3) performance testing / characterization of fabricated rectennas, (4) array implementation of rectennas, in conjunction with signal processing and control circuitry, for heat harvesting (modelling, fabrication and testing), (5) array implementation of rectennas, in conjunction with Readout Integrated Circuitry (mixed-signal ic platform), for IR Imaging application. This project is sponsored by Lockheed Martin Inc. The students involved in this project could involve in one or more of the structures defined above.

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Sensor interface-electronics platform using Raspberry-Pi and Python Programs

The aim of this project is preparing prototype for a sensor interface platform, involving hardware and software designs as well as some 3D drawings. In this project students will learn about discrete level hardware and software design. They will design electronic interface board on PCB and utilize Raspberry Pi to communicate via I2C with the board. At the same time, they will prepare GUI for software. Students should be enthusiastic about circuit and PCB design and very familiar to Python programming with Raspberry Pi. If you are very experienced with programming Arduino instead of Raspberry Pi you can also apply to project and use Arduino.